HCU-MF050T Fiber

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Item Number
F16496

Description
HCU-MF050T Fiber

Numerical Aperture	0.2
Attenuation	@ 1300 nm, ≤ 1.0,@ 850 nm, ≤ 2.8 (dB/km)
Core Diameter	50 ± 3 (µm)
ETFE Buffer Diameter	500 ± 30 (µm)
Core/Clad Offset	< 3 (µm)
Cladding Material	Silica
Buffer Material	ETFE
Operating Temperature	-65 to +125 (ºC)
Short-Term Bend Radius	> 10 (mm)
Long-Term Bend Radius	> 16 (mm)
Proof Test Level	150 (kpsi)
Proof Test Level	1.03 (GPa)
Typical Applications	Factory Automation,Short-to-Medium Distance Communications
Options	Buffer Color,Buffer Diameter,Cabling,Crimp & Cleave Connectorization,Proof Test
Type	Multimode Graded-Index
Cladding Diameter	200 ± 4 (µm)
Coating Diameter	230 +0/-10 (µm)
Coating Material	HCS®
Bandwidth	@ 1300 nm, ≥ 400,@ 850 nm, ≥ 400 (MHz-km)
Core/Coating Offset	< 5 (µm)